Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
The quality of a programming language itself is only one component in the ability of application writers to get the job done. Programming languages can succeed or fail based on th...
This paper proposes a simple and efficient implementation method for a hierarchical coarse grain task parallel processing scheme on a SMP machine. OSCAR multigrain parallelizing c...
As a result of improvements in process technology, more and more components are being integrated into a single System-on-Chip (SoC) design. Communication between these components ...
Sudeep Pasricha, Nikil D. Dutt, Mohamed Ben-Romdha...
Testing object-oriented (OO) software is critical because OO languages are commonly used in developing modern software systems. In testing OO software, one important and yet chall...
Hojun Jaygarl, Sunghun Kim, Tao Xie, Carl K. Chang