In this paper, we present an early performance evaluation of a 624-core cluster based on the Intel® Xeon® Processor 5560 (code named “Nehalem-EP”, and referred to as Xeon 55...
Much research has focused on power conservation for the processor, while power conservation for I/O devices has received little attention. In this paper, we analyze the problem of...
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
Numerous data center services exhibit low average utilization leading to poor energy efficiency. Although CPU voltage and frequency scaling historically has been an effective mea...
Many scientific applications manipulate large amount of data and, therefore, are parallelized on high-performance computing systems to take advantage of their computational power a...