84 search results - page 6 / 17 » Evolvable Hardware System at Extreme Low Temperatures |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—As semiconductor manufacturing enters advanced nanometer design paradigm, aging and device wear-out related degradation is becoming a major concern. Negative Bias Temperature In...
ISLPED
2009
ACM
14 years 2 months ago
2009
ACM
Extreme technology integration in the sub-micron regime comes with a rapid rise in heat dissipation and power density for modern processors. Dynamic voltage scaling is a widely us...
ISLPED
2010
ACM
13 years 7 months ago
2010
ACM
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
ISQED
2009
IEEE
14 years 2 months ago
2009
IEEE
—As device feature size continues to shrink, reliability becomes a severe issue due to process variation, particle-induced transient errors, and transistor wear-out/stress such a...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...