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ASPDAC
2009
ACM
14 years 3 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
AICCSA
2008
IEEE
14 years 3 months ago
2008
IEEE
During the last decades, performance of available hardware resources constantly increased [15], which enabled the assignment of more and more complex tasks to software systems. As...
ISQED
2008
IEEE
14 years 3 months ago
2008
IEEE
Clock meshes have found increasingly wide applications in today’s high-performance IC designs. The inherent routing redundancies associated with clock meshes lead to improved cl...
VTC
2008
IEEE
14 years 3 months ago
2008
IEEE
In digital cooperative relaying, signals from the source-destination and relay-destination links are combined at the destination to achieve spatial diversity. These signals do not ...
BIBE
2007
IEEE
14 years 3 months ago
2007
IEEE
Abstract—Recent improvements in high-throughput genotyping technology make possible genome-wide association studies and status prediction (classification) for common complex dis...