Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
During the last decades, performance of available hardware resources constantly increased [15], which enabled the assignment of more and more complex tasks to software systems. As...
Jens Bruhn, Christian Niklaus, Thomas Vogel, Guido...
Clock meshes have found increasingly wide applications in today’s high-performance IC designs. The inherent routing redundancies associated with clock meshes lead to improved cl...
Xiaoji Ye, Min Zhao, Rajendran Panda, Peng Li, Jia...
In digital cooperative relaying, signals from the source-destination and relay-destination links are combined at the destination to achieve spatial diversity. These signals do not ...
Abstract—Recent improvements in high-throughput genotyping technology make possible genome-wide association studies and status prediction (classification) for common complex dis...