We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with q...
Refereed conferences require every submission to be reviewed by members of a program committee (PC) in charge of selecting the conference program. There are many software packages...
Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...