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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 1 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
ISPD
2006
ACM
175views Hardware» more  ISPD 2006»
14 years 1 months ago
mPL6: enhanced multilevel mixed-size placement
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
DAC
2010
ACM
13 years 7 months ago
Parallel multigrid preconditioning on graphics processing units (GPUs) for robust power grid analysis
Leveraging the power of nowadays graphics processing units for robust power grid simulation remains a challenging task. Existing preconditioned iterative methods that require inco...
Zhuo Feng, Zhiyu Zeng
ICCV
2009
IEEE
15 years 2 days ago
Efficient subset selection based on the Renyi entropy
Many machine learning algorithms require the summation of Gaussian kernel functions, an expensive operation if implemented straightforwardly. Several methods have been proposed t...
Vlad I. Morariu1, Balaji V. Srinivasan, Vikas C. R...
CVPR
2004
IEEE
14 years 9 months ago
Bayesian Assembly of 3D Axially Symmetric Shapes from Fragments
We present a complete system for the purpose of automatically assembling 3D pots given 3D measurements of their fragments commonly called sherds. A Bayesian approach is formulated...
Andrew R. Willis, David B. Cooper