Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
Leveraging the power of nowadays graphics processing units for robust power grid simulation remains a challenging task. Existing preconditioned iterative methods that require inco...
Many machine learning algorithms require the summation of Gaussian kernel
functions, an expensive operation if implemented straightforwardly. Several methods
have been proposed t...
Vlad I. Morariu1, Balaji V. Srinivasan, Vikas C. R...
We present a complete system for the purpose of automatically assembling 3D pots given 3D measurements of their fragments commonly called sherds. A Bayesian approach is formulated...