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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 5 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICDCS
1999
IEEE
14 years 1 months ago
Search Space Reduction in QoS Routing
To provide real-time service or engineer constrained-based paths, networks require the underlying routing algorithm to be able to find low-cost paths that satisfy given Quality-of...
Liang Guo, Ibrahim Matta
ASIACRYPT
2007
Springer
14 years 2 months ago
When e-th Roots Become Easier Than Factoring
We show that computing e-th roots modulo n is easier than factoring n with currently known methods, given subexponential access to an oracle outputting the roots of numbers of the ...
Antoine Joux, David Naccache, Emmanuel Thomé...
KDD
2008
ACM
178views Data Mining» more  KDD 2008»
14 years 9 months ago
Training structural svms with kernels using sampled cuts
Discriminative training for structured outputs has found increasing applications in areas such as natural language processing, bioinformatics, information retrieval, and computer ...
Chun-Nam John Yu, Thorsten Joachims
FOCS
2002
IEEE
14 years 1 months ago
Low-Dimensional Linear Programming with Violations
Two decades ago, Megiddo and Dyer showed that linear programming in two and three dimensions (and subsequently any constant number of dimensions) can be solved in linear time. In ...
Timothy M. Chan