This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Many coupling measures have been proposed in the context of object-oriented (OO) systems. In addition, several studies have highlighted the complexity of using dependency analysis...
The proposed research defines an approach to combine Information Retrieval based analysis of the textual information embedded in software artifacts with program static and dynamic...
Many of the existing techniques for impact set computation in change propagation and regression testing are approximate for the sake of efficiency. A way to improve precision is ...
Coupling measures have important applications in software development and maintenance. They are used to reason about the structural complexity of software and have been shown to p...