103 search results - page 9 / 21 » Fine-grained power management for multithreaded processor co... |
CASES
2006
ACM
13 years 11 months ago
2006
ACM
Technology scaling trends have forced designers to consider alternatives to deeply pipelining aggressive cores with large amounts of performance accelerating hardware. One alterna...
IEEEPACT
2008
IEEE
14 years 2 months ago
2008
IEEE
The emergence of power as a first-class design constraint has fueled the proposal of a growing number of run-time power optimizations. Many of these optimizations trade-off power...
ISCA
2007
IEEE
14 years 2 months ago
2007
IEEE
With increasing speed and power density, high-performance memories, including FB-DIMM (Fully Buffered DIMM) and DDR2 DRAM, now begin to require dynamic thermal management (DTM) a...
INFOCOM
2009
IEEE
14 years 2 months ago
2009
IEEE
—While it is a well known result that network coding achieves optimal flow rates in multicast sessions, its potential for practical use has remained to be a question, due to its...
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...