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ISQED
2007
IEEE
236views Hardware» more  ISQED 2007»
14 years 1 months ago
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu
CCS
2009
ACM
14 years 2 months ago
HAIL: a high-availability and integrity layer for cloud storage
We introduce HAIL (High-Availability and Integrity Layer), a distributed cryptographic system that allows a set of servers to prove to a client that a stored file is intact and r...
Kevin D. Bowers, Ari Juels, Alina Oprea
KBSE
2010
IEEE
13 years 5 months ago
Seamlessly integrated, but loosely coupled: building user interfaces from heterogeneous components
User interface development is a time and resource consuming task. Thus, reusing existing UI components is a desirable approach for rapid UI development. To keep UIs maintainable, ...
Heiko Paulheim
ICS
2003
Tsinghua U.
14 years 18 days ago
Roccom: an object-oriented, data-centric software integration framework for multiphysics simulations
We describe an object-oriented software integration frameccom, abstracted from our five years of experience in developing a complex, integrated code for rocket simulation. Roccom...
Xiangmin Jiao, Michael T. Campbell, Michael T. Hea...
DAC
1999
ACM
13 years 11 months ago
ipChinook: an Integrated IP-based Design Framework for Distributed Embedded Systems
IPCHINOOK is a design tool for distributed embedded systems. It gains leverage from the use of a carefully chosen set of design ions that raise the level of designer interaction d...
Pai H. Chou, Ross B. Ortega, Ken Hines, Kurt Partr...