Identifying, gathering, and maintaining information on the current, planned, and target states of the architecture of an enterprise is one major challenge of enterprise architectur...
Sabine Buckl, Florian Matthes, Christian M. Schwed...
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
In the pursuit of instruction-level parallelism, significant demands are placed on a processor's instruction delivery mechanism. Delivering the performance necessary to meet ...
Power consumption has become one of the biggest challenges in high-performance microprocessor design. The rapid increase in the complexity and speed of each new CPU generation is ...
Vivek Tiwari, Deo Singh, Suresh Rajgopal, Gaurav M...
Developing countries face significant challenges in network access, making even simple network tasks unpleasant. Many standard techniques—caching and predictive prefetching— ...