The relative tolerances for interconnect and device parameter variations have not scaled with feature sizes which have brought about significant performance variability. As we sca...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
: The k nearest neighbor classification (k-NN) is a very simple and popular method for classification. However, it suffers from a major drawback, it assumes constant local class po...
In this paper we analyze the Ricean K-factor for vehicle-to-vehicle (V2V) communications in a typical open suburban street crossing. The channel conditions vary from non line-of si...
Many modern enterprises are collecting data at the most detailed level possible, creating data repositories ranging from terabytes to petabytes in size. The ability to apply sophi...
Sudipto Das, Yannis Sismanis, Kevin S. Beyer, Rain...