Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
This paper gives an overview of works done in our group on 3D and appearance modeling of objects, from images. The backbone of our approach is to use what we consider as the princi...
In this paper, we propose a general cross-layer optimization framework in which we explicitly consider both the heterogeneous and dynamically changing characteristics of delay-sens...
ust control problems can be formulated in abstract form as convex feasibility programs, where one seeks a solution x that satisfies a set of inequalities of the form F . = {f (x,...
We introduce the Minimum-size bounded-capacity cut (MinSBCC) problem, in which we are given a graph with an identified source and seek to find a cut minimizing the number of node...