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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 1 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
CIARP
2009
Springer
15 years 10 months ago
3D and Appearance Modeling from Images
This paper gives an overview of works done in our group on 3D and appearance modeling of objects, from images. The backbone of our approach is to use what we consider as the princi...
Peter F. Sturm, Amaël Delaunoy, Pau Gargallo,...
CORR
2008
Springer
173views Education» more  CORR 2008»
15 years 4 months ago
Decomposition Principles and Online Learning in Cross-Layer Optimization for Delay-Sensitive Applications
In this paper, we propose a general cross-layer optimization framework in which we explicitly consider both the heterogeneous and dynamically changing characteristics of delay-sens...
Fangwen Fu, Mihaela van der Schaar
AUTOMATICA
2007
72views more  AUTOMATICA 2007»
15 years 4 months ago
A probabilistic analytic center cutting plane method for feasibility of uncertain LMIs
ust control problems can be formulated in abstract form as convex feasibility programs, where one seeks a solution x that satisfies a set of inequalities of the form F . = {f (x,...
Giuseppe C. Calafiore, Fabrizio Dabbene
ESA
2005
Springer
114views Algorithms» more  ESA 2005»
15 years 9 months ago
Unbalanced Graph Cuts
We introduce the Minimum-size bounded-capacity cut (MinSBCC) problem, in which we are given a graph with an identified source and seek to find a cut minimizing the number of node...
Ara Hayrapetyan, David Kempe, Martin Pál, Z...