The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
The framework of this paper is the design of complex communication protocols by simulation, based on formal description techniques (FDT). We propose a general-purpose scalable mod...
— A closed-form model for simulation and analysis of voltage transients caused by single-event upsets (SEUs) in logic circuits is described. A linear RC model, derived using a SP...
Real world problems such as fire propagation prediction, can often be considered as a compositional combination of multiple, simple but coupled subproblems corresponding to analyt...
John Michopoulos, Panagiota Tsompanopoulou, Elias ...
For obtaining a zero defect level, a high fault coverage with respect to the stuck-at fault model is often not sufficient as there are many defects that show a more complex behavi...