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DAC
2012
ACM
11 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
SDM
2009
SIAM
180views Data Mining» more  SDM 2009»
14 years 4 months ago
Structure and Dynamics of Research Collaboration in Computer Science.
Complex systems exhibit emergent patterns of behavior at different levels of organization. Powerful network analysis methods, developed in physics and social sciences, have been s...
Andre Nash, Christian Bird, Earl T. Barr, Premkuma...
CIKM
2009
Springer
14 years 2 months ago
Completing wikipedia's hyperlink structure through dimensionality reduction
Wikipedia is the largest monolithic repository of human knowledge. In addition to its sheer size, it represents a new encyclopedic paradigm by interconnecting articles through hyp...
Robert West, Doina Precup, Joelle Pineau
IWSSD
1993
IEEE
13 years 11 months ago
An Active Hypertext Model for System Requirements
We are developing tools to support a conversational metaphor for requirements definition and analysis. Our conversational model consists of three components: (1) a hypertextual re...
Colin Potts, Kenji Takahashi
DAC
1998
ACM
13 years 11 months ago
Buffer Insertion for Noise and Delay Optimization
Interconnect-driven optimization is an increasingly important step in high-performance design. Algorithms for buffer insertion have been successfully utilized to reduce delay in gl...
Charles J. Alpert, Anirudh Devgan, Stephen T. Quay