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ICCAD
2010
IEEE
13 years 8 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ESEM
2007
ACM
14 years 2 months ago
2007
ACM
A common belief is that software designs decay as systems evolve. This research examines the extent to which software designs actually decay by studying the aging of design patter...
IPPS
1996
IEEE
14 years 2 months ago
1996
IEEE
Advances in multiprocessor interconnect technologyare leading to high performance networks. However, software overheadsassociated with message passing are limiting the processors ...
NIME
2005
Springer
14 years 3 months ago
2005
Springer
Electronic Musical Instrument Design is an excellent vehicle for bringing students from multiple disciplines together to work on projects, and help bridge the perennial gap betwee...
OMER
2001
13 years 11 months ago
2001
: This paper shows how architecture description languages can be tailored to the design of embedded automotive control software. Furthermore, graphical modeling means are put in an...