With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
Hybrid architectures combining the strengths of generalpurpose processors with application-specific hardware accelerators can lead to a significant performance improvement. Our ...
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
Abstract. This paper presents a hybrid agents based architecture that uses casebased reasoning and case-based planning systems as reasoning mechanism in deliberative BDI agents to ...
Dante I. Tapia, Javier Bajo, Juan M. Corchado, Sar...