This paper deals with Hybrid multisite testing of VLSI chips by utilizing automatic test equipment (ATE) in connection with built-in self-test (BIST). The performance of a multisi...
Hamidreza Hashempour, Fred J. Meyer, Fabrizio Lomb...
This paper describes a Hybrid DFT (H-DFT) architecture for low-cost, high quality structural testing in the high volume manufacturing (HVM) environment. This structure efficiently...
David M. Wu, Mike Lin, Subhasish Mitra, Kee Sup Ki...
As technology evolves into the deep sub-micron era, signal integrity problems are growing into a major challenge. An important source of signal integrity problems is the crosstalk...
A new hybrid approach consists to use the advantages of both systems namely the high geometric aspects of the electrodes of the ultracapacitor and the high dielectric strength of ...
A. Albina, P. L. Taberna, J. P. Cambronne, P. Simo...
Manufacturing test structures of microsensors and microactuators is very expensive in terms of time and materials. In a conventional design process, this limits the number of desi...