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DAC
2009
ACM
14 years 8 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
DAC
2007
ACM
14 years 8 months ago
A System For Coarse Grained Memory Protection In Tiny Embedded Processors
Many embedded systems contain resource constrained microcontrollers where applications, operating system components and device drivers reside within a single address space with no...
Ram Kumar, Akhilesh Singhania, Andrew Castner, Edd...
DAC
2007
ACM
14 years 8 months ago
A New Twisted Differential Line Structure in Global Bus Design
Twisted differential line structure can effectively reduce crosstalk noise on global bus, which foresees a wide applicability. However, measured performance based on fabricated ci...
Zhanyuan Jiang, Shiyan Hu, Weiping Shi
DAC
2004
ACM
14 years 8 months ago
Toward a methodology for manufacturability-driven design rule exploration
Resolution enhancement techniques (RET) such as optical proximity correction (OPC) and phase-shift mask (PSM) technology are deployed in modern processes to increase the fidelity ...
Luigi Capodieci, Puneet Gupta, Andrew B. Kahng, De...
DAC
2005
ACM
14 years 8 months ago
Multilevel full-chip routing for the X-based architecture
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...
Tsung-Yi Ho, Chen-Feng Chang, Yao-Wen Chang, Sao-J...