3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Abstract: Recently there has been an increasing interest in supporting bulk operations on multidimensional index structures. Bulk loading refers to the process of creating an initi...
Jochen Van den Bercken, Bernhard Seeger, Peter Wid...
This paper presents a morphological lexicon for English that handle more than 317000 inflected forms derived from over 90000 stems. The lexicon is available in two formats. The fi...
Daniel Karp, Yves Schabes, Martin Zaidel, Dania Eg...
Geographic information systems (GIS) must support large georeferenced data sets. Due to the size of these data sets finding exact answers to spatial queries can be very time consum...
Wan D. Bae, Shayma Alkobaisi, Scott T. Leutenegger
Abstract— Especially for tasks like automatic meeting transcription, it would be useful to automatically recognize speech also while multiple speakers are talking simultaneously....
Dorothea Kolossa, Shoko Araki, Marc Delcroix, Tomo...