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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
14 years 1 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
VLDB
1997
ACM
104views Database» more  VLDB 1997»
13 years 11 months ago
A Generic Approach to Bulk Loading Multidimensional Index Structures
Abstract: Recently there has been an increasing interest in supporting bulk operations on multidimensional index structures. Bulk loading refers to the process of creating an initi...
Jochen Van den Bercken, Bernhard Seeger, Peter Wid...
COLING
1992
13 years 8 months ago
A Freely Available Wide Coverage Morphological Analyzer for English
This paper presents a morphological lexicon for English that handle more than 317000 inflected forms derived from over 90000 stems. The lexicon is available in two formats. The fi...
Daniel Karp, Yves Schabes, Martin Zaidel, Dania Eg...
DEXA
2006
Springer
151views Database» more  DEXA 2006»
13 years 9 months ago
An Incremental Refining Spatial Join Algorithm for Estimating Query Results in GIS
Geographic information systems (GIS) must support large georeferenced data sets. Due to the size of these data sets finding exact answers to spatial queries can be very time consum...
Wan D. Bae, Shayma Alkobaisi, Scott T. Leutenegger
ISCAS
2008
IEEE
139views Hardware» more  ISCAS 2008»
14 years 1 months ago
Missing feature speech recognition in a meeting situation with maximum SNR beamforming
Abstract— Especially for tasks like automatic meeting transcription, it would be useful to automatically recognize speech also while multiple speakers are talking simultaneously....
Dorothea Kolossa, Shoko Araki, Marc Delcroix, Tomo...