This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Stochastic techniques for rendering indirect illumination suffer from noise due to the variance in the integrand. In this paper, we describe a general reconstruction technique tha...
Jaakko Lehtinen, Timo Aila, Samuli Laine, Fr&eacut...
—We present an algorithm that simultaneously calibrates two color cameras, a depth camera, and the relative pose between them. The method is designed to have three key features: ...
Daniel Herrera C., Juho Kannala, Janne Heikkil&aum...
This paper describes experiments in automatic recognition of context-independent phoneme strings from meeting data using audiovisual features. Visual features are known to improve ...
In this paper, we propose a new Distributed Cooperation and Diversity Combining framework. Our focus is heterogeneous networks with devices equipped with two types of radio frequen...