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» Integrative, model-based engineering design
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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
COMPSAC
2007
IEEE
14 years 2 months ago
Performance Prediction of Service-Oriented Applications based on an Enterprise Service Bus
An Enterprise Service Bus (ESB) is a standards-based integration platform that combines messaging, web services, data transformation, and intelligent routing in a highly distribut...
Yan Liu, Ian Gorton, Liming Zhu
COMPSAC
1997
IEEE
14 years 3 days ago
A formal approach to software components classification and retrieval
I n this paper, we propose an approach to reuse-based software development using formal method. I n our approach, each software component is annotated with a set of predicates to ...
Chao-Tsun Chang, William C. Chu, Chung-Shyan Liu, ...
GCC
2009
Springer
13 years 5 months ago
On HLA-Based Collaborative Simulation Techniques
The design and development of a complex system as well as the simulation of its dynamic behavior are usually involved in multidisciplinary field knowledge. HLA-based collaborative ...
Fan Miao Miao, Fan Yu Shun
VLSI
2010
Springer
13 years 2 months ago
Spatial EM jamming: A countermeasure against EM Analysis?
Electro-Magnetic Analysis has been identified as an efficient technique to retrieve the secret key of cryptographic algorithms. Although similar mathematically speaking, Power or E...
Francois Poucheret, Lyonel Barthe, Pascal Benoit, ...