2516 search results - page 468 / 504 » Integrity Constraints for XML |
128
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
135
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SACMAT
2009
ACM
15 years 11 months ago
2009
ACM
A number of research systems have demonstrated the benefits of accompanying each request with a machine-checkable proof that the request complies with access-control policy — a...
125
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HOTI
2008
IEEE
15 years 10 months ago
2008
IEEE
Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop elec...
128
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MICRO
2006
IEEE
15 years 10 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
130
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SBCCI
2005
ACM
15 years 10 months ago
2005
ACM
The designer of a system on a chip (SoC) that connects IP cores through a network on chip (NoC) needs methods to support application performance evaluation. Two key aspects these ...