Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
A number of research systems have demonstrated the benefits of accompanying each request with a machine-checkable proof that the request complies with access-control policy — a...
Lujo Bauer, Limin Jia, Michael K. Reiter, David Sw...
Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop elec...
Michael R. T. Tan, Paul Rosenberg, Jong Souk Yeo, ...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
The designer of a system on a chip (SoC) that connects IP cores through a network on chip (NoC) needs methods to support application performance evaluation. Two key aspects these ...
Leonel Tedesco, Aline Mello, Diego Garibotti, Ney ...