Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
The purpose of this paper is to introduce a new approach to teaching an introductory simulation course using an interactive CD-ROM titled "Simply Simulation". This metho...
Multiple simulation runs using the same simulation model with different values of control parameters usually generate large data sets that capture the variational aspects of the be...
Kresimir Matkovic, Denis Gracanin, Mario Jelovic, ...
Most existing work on t-way testing has focused on 2-way (or pairwise) testing, which aims to detect faults caused by interactions between any two parameters. However, faults can ...
Yu Lei, Raghu Kacker, D. Richard Kuhn, Vadim Okun,...
The creation of life-like believable characters is emerging as the central focus of next-generation game development and is viewed as critical to obtaining true mass-market appeal...