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» Interconnect Analysis: From 3-D Structures to Circuit Models
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WACV
2005
IEEE
14 years 1 months ago
Integrating Range and Texture Information for 3D Face Recognition
The performance of face recognition systems that use two-dimensional images depends on consistent conditions w.r.t. lighting, pose, and facial appearance. We are developing a face...
Xiaoguang Lu, Anil K. Jain
PAMI
2010
417views more  PAMI 2010»
13 years 6 months ago
Auto-Context and Its Application to High-Level Vision Tasks and 3D Brain Image Segmentation
The notion of using context information for solving high-level vision and medical image segmentation problems has been increasingly realized in the field. However, how to learn a...
Zhuowen Tu, Xiang Bai
SMA
2005
ACM
167views Solid Modeling» more  SMA 2005»
14 years 1 months ago
Boolean operations on 3D selective Nef complexes: optimized implementation and experiments
Nef polyhedra in d-dimensional space are the closure of half-spaces under boolean set operation. In consequence, they can represent non-manifold situations, open and closed sets, ...
Peter Hachenberger, Lutz Kettner
TVLSI
2010
13 years 2 months ago
Fast Analysis of a Large-Scale Inductive Interconnect by Block-Structure-Preserved Macromodeling
To efficiently analyze the large-scale interconnect dominant circuits with inductive couplings (mutual inductances), this paper introduces a new state matrix, called VNA, to stamp ...
Hao Yu, Chunta Chu, Yiyu Shi, David Smart, Lei He,...
3DPVT
2002
IEEE
193views Visualization» more  3DPVT 2002»
14 years 17 days ago
Modeling shapes and textures from images: new frontiers
Increasingly, models of the world are directly built from images. The paper discusses a number of recent developments that try to push the enveloppe of what image-based modeling c...
Luc J. Van Gool, D. Vandemeulen, Gregor A. Kalbere...