162 search results - page 15 / 33 » Interconnect Analysis: From 3-D Structures to Circuit Models |
ICCAD
2002
IEEE
14 years 4 months ago
2002
IEEE
A novel circuit topology for inductive coupling between interconnecting wires is presented. The model is local, i.e., only coupling between neighboring wires is explicitly modeled...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
ISCAS
2003
IEEE
14 years 26 days ago
2003
IEEE
An efficient model-order reduction technique for general RLC networks is proposed. The method is extended from the previous projection-base moment matching method with considerin...
ACCV
2006
Springer
14 years 1 months ago
2006
Springer
We view the task of change detection as a problem of object recognition from learning. The object is defined in a 3D space where the time is the 3rd dimension. We propose two com...
BMCBI
2006
13 years 7 months ago
2006
Background: Availability of high-resolution RNA crystal structures for the 30S and 50S ribosomal subunits and the subsequent validation of comparative secondary structure models h...