163 search results - page 29 / 33 » Interconnecting Computers: Architecture, Technology, and Eco... |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
VLSID
2006
IEEE
14 years 1 months ago
2006
IEEE
This tutorial focuses on advanced techniques to cope with the complexity of designing modern digital chips which are complete systems often containing multiple processors, complex...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
DAC
2006
ACM
13 years 9 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
ASAP
2005
IEEE
14 years 29 days ago
2005
IEEE
In this paper we introduce a design methodology that allows the system/circuit designer to build reliable systems out of unreliable nano-scale components. The central point of our...