In the world of pervasive computing where large management systems, as well as small devices, all become interconnected, the problem of the configuration and management of network...
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
This paper presents a statistical framework to cooperatively design and develop technology, product circuit, benchmarking and model early in the development stage. The statistical...
Choongyeun Cho, Daeik D. Kim, Jonghae Kim, Jean-Ol...
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
Awet Yemane Weldezion, Matt Grange, Dinesh Pamunuw...