108 search results - page 15 / 22 » Introspective 3D chips |
TCAD
2008
13 years 8 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
CODES
2007
IEEE
14 years 3 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
EGH
2004
Springer
14 years 2 months ago
2004
Springer
Realtime ray tracing has recently established itself as a possible alternative to the current rasterization approach for interactive 3D graphics. However, the performance of exist...
3DIC
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
DAC
2000
ACM
14 years 9 months ago
2000
ACM
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...