108 search results - page 7 / 22 » Introspective 3D chips |
ICMCS
2006
IEEE
14 years 1 months ago
2006
IEEE
This paper presents a new spatio-temporal motion estimation algorithm for video coding. The algorithm is based on optimization theory and consists of the strategies including 3D s...
DFT
2004
IEEE
13 years 11 months ago
2004
IEEE
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
DAC
1998
ACM
14 years 8 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
DAC
2009
ACM
14 years 8 days ago
2009
ACM
We propose GRIP, a scalable global routing technique via Integer Programming (IP). GRIP optimizes wirelength and via cost without going through a layer assignment phase. GRIP sele...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...