1973 search results - page 63 / 395 » Issues in the Integration of IN and TMN |
HPCA
2001
IEEE
14 years 8 months ago
2001
IEEE
In this papel; we address the severe performance gap caused by high processor clock rates and slow DRAM accesses. We show that even with an aggressive, next-generation memory syst...
ICCD
2004
IEEE
14 years 5 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
SBP
2010
Springer
14 years 2 months ago
2010
Springer
Abstract. The health system is a complex system of systems – changes in agriculture, transportation, economics, family life, medical practices, and many other things can have a p...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ICRA
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract— This paper discusses an integration issue of multilevel postural balancing on humanoid robot. We give a unified viewpoint of postural balancing, which covers Ankle Str...