Abstract-- Process scaling and higher leakage power have resulted in increased power densities and elevated die temperatures. Due to the interdependence of temperature and leakage ...
Aseem Gupta, Nikil D. Dutt, Fadi J. Kurdahi, Kamal...
Multi-million gate System-on-Chip (SoC) designs increasingly rely on Intellectual Property (IP) blocks. However, due to technology scaling the leakage power consumption of the IP ...
Aseem Gupta, Nikil D. Dutt, Fadi J. Kurdahi, Kamal...