1295 search results - page 106 / 259 » Layered manufacturing technologies |
106
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ICWS
2009
IEEE
16 years 1 months ago
2009
IEEE
: © Mobile In-Store Personalized Services Jun Li, Ismail Ari, Jhilmil Jain, Alan H. Karp, Mohamed; Dekhil HP Laboratories HPL-2009-48 mobile shopping assistant, cross-organization...
128
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—With the increasing scaling of manufacturing technology, process variation is a phenomenon that has become more prevalent. As a result, in the context of Chip Multiproce...
135
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CAISE
2004
Springer
15 years 9 months ago
2004
Springer
Abstract. Specification of systems in a software product line (product-line members) is often supported by domain-specific languages (DSLs) that provide pownguage abstractions for ...
150
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DAC
2003
ACM
15 years 9 months ago
2003
ACM
In recent years, due to rapid advances in VLSI manufacturing technology capable of packing more and more devices and wires on a chip, crosstalk has emerged as a serious problem af...
157
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...