1295 search results - page 140 / 259 » Layered manufacturing technologies |
DATE
2010
IEEE
14 years 1 months ago
2010
IEEE
Abstract--Leakage power consumption contributes significantly to the overall power dissipation for systems that are manufactured in advanced deep sub-micron technology. Different f...
ISCA
1999
IEEE
14 years 1 months ago
1999
IEEE
In response to the growing gap between memory access time and processor speed, DRAM manufacturers have created several new DRAM architectures. This paper presents a simulation-bas...
AOSD
2007
ACM
14 years 1 months ago
2007
ACM
The traditional constraints on software development and architectures in the consumer electronics domain, including the low cost of manufacturing of a product, support for familie...
ASPDAC
2007
ACM
14 years 1 months ago
2007
ACM
- For sub-90nm technology nodes and below, random fluctuations of within-die physical process properties are also known as random on-chip variation (OCV). It impacts on the VLSI/So...
ASPDAC
2007
ACM
14 years 1 months ago
2007
ACM
- Advanced process technologies impose more significant challenges especially when manufactured circuits exhibit substantial process variations. Consideration of process variations...