1295 search results - page 153 / 259 » Layered manufacturing technologies |
ITCC
2005
IEEE
14 years 2 months ago
2005
IEEE
Construction activities take place in what can be called a dynamic virtual organization (VO). VOs require a secure, reliable, scalable information infrastructure that allows colla...
PERVASIVE
2005
Springer
14 years 2 months ago
2005
Springer
The retail store environment is a challenging application area for Pervasive Computing technologies. It has demanding base conditions due to the number and complexity of the interd...
ASPLOS
2008
ACM
13 years 11 months ago
2008
ACM
We explore the extent to which newly available CPU-based security technology can reduce the Trusted Computing Base (TCB) for security-sensitive applications. We find that although...
SIGMOD
2006
ACM
14 years 9 months ago
2006
ACM
"Wow. I fell asleep listening to SOA music, and when I woke up, I couldn't remember where I'd put my data. Now what?" Has this happened to you? With the new pu...
ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...