1295 search results - page 19 / 259 » Layered manufacturing technologies |
GLVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
MMS
2008
13 years 7 months ago
2008
As the broadcast industry is evolving toward IT-based facilities, the production workflows and their associated production metadata should similarly take advantage of IT commoditi...
ASPDAC
2012
ACM
12 years 3 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
DATE
2002
IEEE
14 years 13 days ago
2002
IEEE
Abstract—Antenna problem is a phenomenon of plasma-induced gateoxide degradation. It directly affects manufacturability of very large scale integration (VLSI) circuits, especiall...