1295 search results - page 205 / 259 » Layered manufacturing technologies |
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
DNA
2009
Springer
14 years 3 months ago
2009
Springer
Recently we have shown how molecular logic circuits with many components arranged in multiple layers can be built using DNA strand displacement reactions. The potential application...
ASPDAC
2009
ACM
14 years 3 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
SOUPS
2009
ACM
14 years 3 months ago
2009
ACM
Abstract. Online privacy policies are difficult to understand. Most privacy policies require a college reading level and an ability to decode legalistic, confusing, or jargon-laden...
INFOCOM
2008
IEEE
14 years 3 months ago
2008
IEEE
Abstract—IEEE 802.16e WiMAX is a promising new technology for broadband access networks. Amongst the class of applications that can be supported is real time video services (such...