1295 search results - page 222 / 259 » Layered manufacturing technologies |
DATE
2010
IEEE
14 years 20 days ago
2010
IEEE
—In a conventional SoC designs, on-chip memories occupy more than the 50% of the total die area. 3D technology enables the distribution of logic and memories on separate stacked ...
COOPIS
2002
IEEE
14 years 16 days ago
2002
IEEE
CORBA is an important standard middleware used in the development of distributed applications. It has also been used with distributed real-time applications, through its extension ...
ISQED
2002
IEEE
14 years 14 days ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
CAISE
2001
Springer
14 years 2 days ago
2001
Springer
A major requirement in Software Engineering is to reduce the time to market. This requirement along with a demand for product sophistication and better quality has led to larger te...
WER
2001
Springer
13 years 12 months ago
2001
Springer
Workflow technology has reached a reasonable degree of maturity, with a number of both research prototypes and commercial systems available. However, methodological issues have rec...