One of the main challenges in image segmentation is to adapt prior knowledge about the objects/regions that are likely to be present in an image, in order to obtain more precise d...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
In this paper we present a low-complexity traffic prioritization strategy for video transmission using the H.264 scalable video coding (SVC) standard over 802.11e wireless networ...
—The IEEE 802.16 standard, or WiMAX, has emerged as one of the strongest contenders for broadband wireless access technology. In our previous work, we proposed a protocol using r...
— This paper investigates the path protection problem in mesh networks under multiple generic risks. Disjoint logical links may fail simultaneously if they share the same compone...