116 search results - page 5 / 24 » Leakage temperature dependency modeling in system level anal... |
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ICSM
2007
IEEE
14 years 2 months ago
2007
IEEE
Uncovering, modelling, and understanding architectural level dependencies of software systems is a key task for software maintainers. However, current dependency analysis techniqu...
IJSEKE
2006
13 years 7 months ago
2006
tion and alteration of software models at different levels of abstraction. These modifications are usually performed independently, but the objects to which they are applied to, ar...
KBSE
2008
IEEE
14 years 2 months ago
2008
IEEE
Evolution of software systems is characterized by inevitable changes of software and increasing software complexity, which in turn may lead to huge maintenance and development cos...
GLVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...