858 search results - page 119 / 172 » Lin's method |
ICCAD
2006
IEEE
14 years 5 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
ICCAD
2005
IEEE
14 years 5 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
ICCAD
2004
IEEE
14 years 5 months ago
2004
IEEE
Improving logic capacity by time-sharing, dynamically reconfigurable FPGAs are employed to handle designs of high complexity and functionality. In this paper, we model each task ...
CVPR
2009
IEEE
14 years 3 months ago
2009
IEEE
We address the problem of tracking points in dense vector fields. Such vector fields may come from computational fluid dynamics simulations, environmental monitoring sensors, o...
CVPR
2009
IEEE
14 years 3 months ago
2009
IEEE
The objective of this paper is to parse object trajectories in surveillance video against occlusion, interruption, and background clutter. We present a spatio-temporal graph (ST-G...