Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
Abstract. Two main challenges of robot action planning in real domains are uncertain action effects and dynamic environments. In this paper, an instance-based action model is lear...
Purpose – This article is the third in a four-part series that aims to illustrate the process involved in planning a portal and creating a portal definition document. Design/me...
: We consider socio-technical processes, i.e. processes where machines as well as humans participate. Typical examples occur in sales processes in e-commerce. Three modeling tasks ...
Through analysis of present pseudo-parallel genetic algorithm, propose a new dynamic sub-population pseudo-parallel genetic algorithm. It changes the condition that the magnitude o...