1307 search results - page 109 / 262 » Low Power Hardware for a High Performance PDA |
189
Voted
IPSN
2005
Springer
15 years 11 months ago
2005
Springer
— We present Telos, an ultra low power wireless sensor module (“mote”) for research and experimentation. Telos is the latest in a line of motes developed by UC Berkeley to en...
153
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ASPDAC
2009
ACM
15 years 10 months ago
2009
ACM
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
135
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ICMENS
2005
IEEE
15 years 11 months ago
2005
IEEE
The influence of thermal effects on the reliability of RF MEMS switches is investigated in this paper. Low power consumption and capacity to handle high power at very high frequen...
176
Voted
DFT
2006
IEEE
16 years 6 days ago
2006
IEEE
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...
150
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ASYNC
2000
IEEE
15 years 10 months ago
2000
IEEE
This paper introduces several new asynchronous pipeline designs which offer high throughput as well as low latency. The designs target dynamic datapaths, both dualrail as well as ...