16 search results - page 3 / 4 » Low-swing interconnect interface circuits |
CORR
1998
Springer
13 years 10 months ago
1998
Springer
Abstract In this paper we describe a hands-on laboratory oriented instructional package that we have developed for data communications and networking. The package consists of a sof...
TEI
2010
ACM
14 years 5 months ago
2010
ACM
The ChainMail system is a scalable electronic sensate skin that is designed as a dense sensor network. ChainMail is built from small (1”x1”) rigid circuit boards attached to t...
ASPDAC
2007
ACM
14 years 2 months ago
2007
ACM
In a realistic design flow, circuit and system optimizations must interact with physical aspects of the design. For example, improvements in timing and power may require replacing ...
DAC
2008
ACM
14 years 12 months ago
2008
ACM
In modular testing of system-on-a-chip (SoC), test access mechanisms (TAMs) are used to transport test data between the input/output pins of the SoC and the cores under test. Prio...
ISCA
2007
IEEE
14 years 5 months ago
2007
IEEE
We introduce a novel chip fabrication technique called “brick and mortar”, in which chips are made from small, pre-fabricated ASIC bricks and bonded in a designer-specified a...