3103 search results - page 269 / 621 » Managing Concern Interfaces |
MICRO
2006
IEEE
14 years 4 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
SOUPS
2006
ACM
14 years 4 months ago
2006
ACM
While Internet users claim to be concerned about online privacy, their behavior rarely reflects those concerns. In this paper we investigate whether the availability of compariso...
ICCS
1999
Springer
14 years 3 months ago
1999
Springer
Conceptual Graphs and Formal Concept Analysis have in common basic concerns: the focus on conceptual structures, the use of diagrams for supporting communication, the orientation b...
IWAN
2000
Springer
14 years 2 months ago
2000
Springer
This paper presents the main concepts of the IST Project FAIN "Future Active IP Networks" [10], a three-year collaborative research project, whose main task is to develo...
NORDICHI
2004
ACM
14 years 4 months ago
2004
ACM
This case study examines a procurement project where the Swedish National Labor Market Administration (AMV) hired usability consultants in order to redesign their website for empl...