164 search results - page 14 / 33 » Measuring performance, power, and temperature from real proc... |
NOCS
2010
IEEE
13 years 6 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
ASPDAC
2008
ACM
13 years 10 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
ISLPED
2005
ACM
14 years 1 months ago
2005
ACM
This paper studies the impact on energy efficiency and thermal behavior of design style and clock-gating style in queue and array structures. These structures are major sources of...
SIES
2008
IEEE
14 years 2 months ago
2008
IEEE
—Chip multiprocessing design is an emerging trend for embedded systems. In this paper, we introduce a Java multiprocessor system-on-chip called JopCMP. It is a symmetric shared-m...
SIGCOMM
2009
ACM
14 years 2 months ago
2009
ACM
Besides a more widespread sensitivity to ecological issues, the interest in energy-efficient network technologies springs from heavy and critical economical needs, since both ener...