260 search results - page 11 / 52 » Measuring power and temperature from real processors |
CODES
2007
IEEE
14 years 3 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ASPLOS
2004
ACM
14 years 2 months ago
2004
ACM
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
FORMATS
2009
Springer
14 years 3 months ago
2009
Springer
For software development, testing is still the primary choice for investigating the correctness of a system. Automated testing is of utmost importance to support continuous integra...
TCAD
2008
13 years 9 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
DAC
2006
ACM
14 years 3 months ago
2006
ACM
We present a new method for mathematically estimating the active unit power of functional units in modern microprocessors such as the Pentium 4 family. Our method leverages the ph...