3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
Mohamed A. Gomaa, Michael D. Powell, T. N. Vijayku...
For software development, testing is still the primary choice for investigating the correctness of a system. Automated testing is of utmost importance to support continuous integra...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
We present a new method for mathematically estimating the active unit power of functional units in modern microprocessors such as the Pentium 4 family. Our method leverages the ph...
Wei Wu, Lingling Jin, Jun Yang 0002, Pu Liu, Sheld...