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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 2 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2005
ACM
16 years 2 months ago
IRON file systems
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
Vijayan Prabhakaran, Lakshmi N. Bairavasundaram, N...
EUROGRAPHICS
2010
Eurographics
16 years 14 days ago
Articulated Billboards for Video-based Rendering
We present a novel representation and rendering method for free-viewpoint video of human characters based on multiple input video streams. The basic idea is to approximate the art...
Marcel Germann, Alexander Hornung, Richard Keiser,...
WWW
2010
ACM
16 years 13 days ago
A scalable machine-learning approach for semi-structured named entity recognition
Named entity recognition studies the problem of locating and classifying parts of free text into a set of predefined categories. Although extensive research has focused on the de...
Utku Irmak, Reiner Kraft
ACSAC
2009
IEEE
16 years 9 days ago
Enabling Secure Secret Sharing in Distributed Online Social Networks
—We study a new application of threshold-based secret sharing in a distributed online social network (DOSN), where users need a means to back up and recover their private keys in...
Le-Hung Vu, Karl Aberer, Sonja Buchegger, Anwitama...