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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2005
ACM
14 years 4 months ago
IRON file systems
Commodity file systems trust disks to either work or fail completely, yet modern disks exhibit more complex failure modes. We suggest a new fail-partial failure model for disks, ...
Vijayan Prabhakaran, Lakshmi N. Bairavasundaram, N...
EUROGRAPHICS
2010
Eurographics
14 years 2 months ago
Articulated Billboards for Video-based Rendering
We present a novel representation and rendering method for free-viewpoint video of human characters based on multiple input video streams. The basic idea is to approximate the art...
Marcel Germann, Alexander Hornung, Richard Keiser,...
WWW
2010
ACM
14 years 2 months ago
A scalable machine-learning approach for semi-structured named entity recognition
Named entity recognition studies the problem of locating and classifying parts of free text into a set of predefined categories. Although extensive research has focused on the de...
Utku Irmak, Reiner Kraft
ACSAC
2009
IEEE
14 years 2 months ago
Enabling Secure Secret Sharing in Distributed Online Social Networks
—We study a new application of threshold-based secret sharing in a distributed online social network (DOSN), where users need a means to back up and recover their private keys in...
Le-Hung Vu, Karl Aberer, Sonja Buchegger, Anwitama...