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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
14 years 6 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
CANS
2009
Springer
165views Cryptology» more  CANS 2009»
14 years 3 months ago
Blink 'Em All: Scalable, User-Friendly and Secure Initialization of Wireless Sensor Nodes
Abstract. Wireless sensor networks have several useful applications in commercial and defense settings, as well as user-centric personal area networks. To establish secure (point-t...
Nitesh Saxena, Md. Borhan Uddin
IPC
2007
IEEE
14 years 3 months ago
Design and Validation of a Low-Power Network Node for Pervasive Applications
Pervasive computing refers to making many computing devices available throughout the physical environment, while making them effectively invisible to the user. To further increase...
Juan-Carlos Cano, Carlos Miguel Tavares Calafate, ...
GLOBECOM
2006
IEEE
14 years 3 months ago
Multi-Stage Investment Decision under Contingent Demand for Networking Planning
Telecommunication companies, such as Internet and cellular service providers, are seeing rapid and uncertain growth of traffic routed through their networks. It has become a chall...
Miguel F. Anjos, Michael Desroches, Anwar Haque, O...
ICWMC
2006
IEEE
14 years 3 months ago
Power Characterization of a Bluetooth-based Wireless Node for Ubiquitous Computing
Abstract— Ubiquitous computing refers to making many computing devices available throughout the physical environment, while making them effectively invisible to the user. To furt...
Juan-Carlos Cano, José-Manuel Cano, Eva Gon...