137 search results - page 20 / 28 » Minimizing power across multiple technology and design level... |
VLSID
2007
IEEE
14 years 7 months ago
2007
IEEE
Today's feature-rich multimedia products require embedded system solution with complex System-on-Chip (SoC) to meet market expectations of high performance at a low cost and l...
IPPS
2007
IEEE
14 years 1 months ago
2007
IEEE
To use heterogeneous and geographically distributed resources as a platform for parallel visualization is an intriguing topic of research. This is because of the immense potential...
INTEGRATION
2008
13 years 7 months ago
2008
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
DAC
1997
ACM
13 years 11 months ago
1997
ACM
A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...
DATE
2010
IEEE
14 years 17 days ago
2010
IEEE
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...